ASE Technology Holding Co., Ltd.
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ASE Technology Holding Co., Ltd. is the world's largest provider of semiconductor assembly, testing, and packaging services (OSAT - outsourced semiconductor assembly and test). The company provides a comprehensive range of back-end semiconductor manufacturing services including IC packaging, testing, system-in-package solutions, and electronics manufacturing services. ASE Technology serves major semiconductor companies that design chips but outsource packaging and testing to specialized providers. The company's capabilities span advanced packaging technologies including flip chip, fan-out wafer-level packaging, 2.5D/3D packaging, and system-in-package solutions critical for high-performance computing, mobile, automotive, and IoT applications. ASE Technology operates manufacturing facilities across Taiwan, China, Japan, Korea, Malaysia, Singapore, and other locations. Headquartered in Kaohsiung, Taiwan, ASE Technology benefits from growing semiconductor complexity, advanced packaging demand driven by AI and high-performance computing, and the essential role of OSAT services in the global semiconductor supply chain.